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Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
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Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2 5/3D Chip Designs

December 17, 2020 Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif., December 16, 2020 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius™ Thermal Solver and Clarity™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more

Ben guSangyun kimSigrity systemCadence design systems incGroup at cadenceCompanies to workFoundry design technology team at samsung electronicsCadence design systemsSamsung foundrySamsung multi die integrationThermal solverCelsius thermal solverIntegrity solutionPackage designer plusImplementation systemInterconnect designer

Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2 5/3D Chip Designs – IT Business Net

Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI ™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius ™ Thermal Solver and Clarity ™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more informati

Ben guSangyun kimSigrity systemCadence design systems incGroup at cadenceCompanies to workFoundry design technology team at samsung electronicsCelsius thermal solverCadence design systemsSamsung foundrySamsung multi die integrationThermal solverIntegrity solutionPackage designer plusImplementation systemInterconnect designer