To support demand from high-growth markets like communications and sensors, InP processing capability is getting more advanced with a higher degree of automation, with the industry also looking to 6” to increase die per wafer.
Recently Oxford Instruments announced the launch of their SiC substrate contactless plasma polishing solution. The aim of this technology is to supersede the established chemical mechanical planarization CMP process, with a clean, dry, lower cost, higher yield and sustainable alternative.
Following Oxford Instruments announcement of their plasma alternative to CMP product, being launched at the International Conference on Silicon Carbide and Related Materials (ICSCRM / ECSCRM) in Davos Switzerland on 11-16 September 2022, Oxford Instruments shares exciting news.