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Molex unveils chip-to-chip 224G product portfolio to accelerate support for next-gen data centres & generative AI applications – CIE

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Jairo guerreroCopper solutionsAccelerator infrastructure groupInnovations empowerMirror mezz enhancedMirror mezzMezz enhancedMirror mezz proOpen control moduleOpen accelerator infrastructure groupOpen compute projectDirect attachActive electrical cable

Accelerating support for next-gen data centres and generative AI applications

Accelerating support for next-gen data centres and generative AI applications
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Jairo guerreroAccelerator infrastructure groupCopper solutionsMirror mezz enhancedMirror mezzMirror mezz proOpen control moduleOpen accelerator infrastructure groupOpen computeDirect attachActive electrical cable

Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications

Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications
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Jairo guerreroAccelerator infrastructure groupCopper solutionsInnovations empowerMirror mezzMezz enhancedMirror mezz proOpen control moduleOpen accelerator infrastructure groupOpen compute projectDirect attachActive electrical cableMirror mezz enhanced

Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications

High-speed I/O, genderless backplane cables, mezzanine board-to-board connectors and near-ASIC connector-to-cable solutions speed path to 224 Gbps-PAM4.

Jairo guerreroPrnewswire molexAccelerator infrastructure groupCopper solutionsInnovations empowerMirror mezzMezz enhancedMirror mezz proOpen control moduleOpen accelerator infrastructure groupOpen compute projectDirect attachActive electrical cableMirror mezz enhancedMolex incorporated