Jan 13, 2021 08:12 EST
In a presser, TrendForce has announced that as per their investigation, TSMC will be mass-producing Intel s next-generation entry-level, mid-range and high-end CPUs on its 5nm and 3nm process nodes. Intel has already announced that it will be outsourcing several of its non-CPU chips to 3rd party foundries but this major news confirms that they are planning to move even their biggest product lineups to external fabs.
Intel s Next-Gen Core i3 CPUs To Be Produced on TSMC s 5nm Process Node, High-End & Mid-Range CPUs To Be Produced on TSMC s 3nm Node in 2H 2022
It looks like after Alder Lake in 2H 2021, Intel will be moving to TSMC as its prime partner in mass-producing its next-generation CPU lineup. The press release states that Intel s Core i3 CPUs will be the first mass-production lineup made at TSMC and will be utilizing its 5nm process node. Do note that mass production doesn t exactly means a hard launch and we might end up getting these chips later
Technisys s Digital Banking Processing Platform scored highest in the Architecture Criteria, in Retail Banking Report from Leading Independent Research Firm
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MIAMI, Jan. 12, 2021 /PRNewswire/
Technisys, the company behind the next-gen core and digital acceleration platform, Cyberbank, has been ranked as a Strong Performer by Forrester in the research firm s recent report:
The Forrester Wave™: Digital Banking Processing Platforms (Retail Banking), Q3 2020. Technisys s digital banking platform scored highest in two of the criteria: Digital Banking Foundation and Architecture with the report stating that: Technisys drives business agility with a lean core and built-in flexibility.
Technisys Ranked Highest In Criteria Of Architecture And Digital Banking Foundation In The Forrester Wave™