Wafer Level Packaging Market Size Worth $19 6 Billion By 2030: IndustryARC sandiegosun.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from sandiegosun.com Daily Mail and Mail on Sunday newspapers.
Global IC Packaging Market To Surpass USD 77 89 Billion By 2030 Driven By Increasing Government Support menafn.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from menafn.com Daily Mail and Mail on Sunday newspapers.
Fan-Out Wafer Level Packaging Industry size is expected to register 10% CAGR between 2023 and 2032 propelled by the growing penetration of miniaturized.
/PRNewswire/ A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled.
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The Neuromorphic Chip Market is valued at USD 1.952 Billion in 2020, and is expecetd to reach USD 7.388 Billion in 2026, registering a CAGR of 24.51% over the forecast period 2021 - 2026. Keeping the pace of advancement of disruptive technologies, such as artificial intelligence (AI) and machine learning (ML), various embedded system providers are keen to develop brain chips, where not only the chips will be processed fast, but will have also responses like human brains for those systems to think and act in a human way.
Data analytics, the Internet of Things (IoT), and smart sensors are considered as major applications for the neuromorphic chip market, as these chips are embedded into hardware used for image recognition, data mining, etc.