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Semiconductor packaging: A new front in US-China contest for tech supremacy | Jane Lanhee Lee, Ian King, Mackenzie Hawkins & Jillian Deutsch

President Joe Biden has adopted a two-pronged approach to constrain China’s high-tech progress, curbing Beijing’s access to leading edge chips while bolstering semiconductor production in the US. He’s about to ratchet up the pressure further, shifting focus to an emerging arena of the contest for technological supremacy: the process of…

A new front is opening up in the US-China conflict over chips

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There's a viewpoint piece on the Amazon-Nokia patent dispute, the value of the semiconductor market, Ireland being set to launch its first satellite, the US allocating $3 billion of Chips Act money, and MicroLED commercialisation.

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