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High-Frequency Technology Entirely in Glass To remain competitive in the field of the Internet of Things, even medium-sized industrial and process metrology companies need to increasingly integrate their sensor circuits into ASICs (application-specific integrated circuits). The semiconductor industry is currently meeting this need with lower costs for development cycles and decreasing quantity hurdles. This is not occurring often enough in chip packaging, meaning that ASICs requiring individual packages are at risk of being bogged down due to the quantity hurdles of package service providers, most of which are Asian. This issue is now resolved by a consortium of seven partners from industry and research.

Pactech gmbLithoglas gmbGerman federal ministry of educationFraunhofer institute for reliabilityLaser electronicsInstitute for microwave technology of ulm universityInterposer technologyImplementing highly compact electronic systemsGerman federal ministryFraunhofer instituteUsing pactechMicrowave technologyUlm universityMetrology gmbhஜெர்மன் கூட்டாட்சியின் அமைச்சகம் ஆஃப் கல்விப்ரௌுந்ொபேர் நிறுவனம் க்கு நம்பகத்தன்மை