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ASMPT AMICRA a worldwide leading supplier of ultrahigh precision die attach equipment that specializes in ultrahigh precision die attach solutions and Teramount Ltd the leader in scalable fiber connectivity to chips today announced a collaboration to address the challenge of connecting fibers to silicon photonic chips to meet the evergrowing bandwidth demands in datacom and telecom applications.

Israel generalJohann weinhaendlerHesham tahaTeramount ltdBusiness wireSilicon photonicsManaging directorUniversal photonic couplerMass transfer printingMedia contactTeramount ltd asmpt amicra hesham taha collaborate silicon photonics packaging collaboration fiber connectivity chips supplier connecting fibers datacom telecom bandwidth fibertochip wafers dr johann weinhaendler optical optics data center computing sensors universal photonic coupler high precision die limited