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news China must pursue chip assembly, packaging breakthroughs to catch up with semiconductor leaders, experts say Iris Deng iris.deng@scmp.com © Bloomberg China’s semiconductor industry has an opportunity to expand by focusing on advanced chip assembly and packaging technologies. Photo: Bloomberg China must pursue breakthroughs in chip assembly and packaging technologies to catch up with global industry leaders, according to experts who spoke on Wednesday at the World Semiconductor Conference held in the eastern city of Nanjing. The world s second-largest economy now has an opportunity to catch up as the semiconductor industry grapples with maintaining annual growth in chip performance, which declined to 3 per cent this year from a high of 57 per cent in 2002, said Wu Hanming, a fellow at the Chinese Academy of Engineering (CAE), according to conference transcripts obtained by the South China Morning Post.

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