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Samsung makes a strategic move by hiring former TSMC executive

Samsung has hired Lin Jun-cheng to compete with TSMC to further strengthen its position in the advanced chip manufacturing market. - SamMobile

United statesSouth koreaSouth koreanLin jun chengKwon jung hyunBenny katibianSamsung advanced packaging teamPackaging solution centerMicron technologyDevice solutionsSenior vice presidentAdvanced packaging teamKorea heraldLow power earlyDevice solution

Samsung aims to start manufacturing 3nm chips in 2022

Samsung aims to start manufacturing 3nm chips in 2022
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