Huawei is all set to introduce its next foldable device, the Mate X2. The company has already confirmed that it will launch the phone on February 22 in China. This time around, the successor will be vastly different from its predecessor. According to the official poster from Huawei, the Mate X2 will be an inward-foldable phone rather than featuring the outward-folding design found on the Mate X and Mate Xs. Now, a new render of the phone has surfaced online.
The render, which can be seen in the featured image of the article was shared by Digital Chat Station on Weibo.
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GSMArena), the next upcoming HUAWEI foldable is ‘coming soon’ powered by a 5nm chipset. Now, as per older leaks, this 5nm chipset in question will debut as Kirin 9000, and might be the last HiSilicon Kirin processor, thanks in no part to trade sanctions imposed by the US government that have crippled HUAWEI’s access to the semiconductor supply chain. The Kirin 9000 will likely be a 5G-ready chip, much like its predecessor.
HUAWEI Mate X2 might rock an inward-folding design similar to Samsung Galaxy Fold
The leak also mentions a few design changes, but doesn’t really specify them. As per a couple of patents filed by HUAWEI, the company might change its design approach towards making foldable smartphones with the Mate X2. So far, the company has launched foldables with an outward folding design, but the Mate X2 might employ an inward folding design akin to the Samsung Galaxy Z Fold 2 and its predecessor. Plus, there will also be a secondary cover display this time aro