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The global market for E-Beam Wafer Inspection System is projected to reach US$1.2 billion by 2025, driven by the growing demands placed on semiconductor companies to optimize yield management.
The focus on metrology and high performance quality control is therefore increasing. Rapid digitalization and evolution of Internet of Things (IoT), Artificial Intelligence (AI), and machine learning technologies are driving the need for faster, smaller, low power devices, bringing in new challenges for semiconductor manufacturers.
While wafer size is increasing from 200 mm to 300nm, critical dimensions of semiconductor circuits (patterns) is rapidly shrinking to 0.13 um and 0.10 um. As critical dimensions shrink, identifying defects becomes more difficult and time-consuming. However, in order to ensure profitability and production efficiency, yield limiting defects need to be identified early on in the manufacturing