Gov Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging forextv.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from forextv.com Daily Mail and Mail on Sunday newspapers.
To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue. Industry s first investment in advanced packaging for AI products on American soil, strengthens supply-chain resilience SEOUL, South Korea, April 4, 2024 /PRNews.
It’s no secret that new home prices have soared since the COVID-19 pandemic. Rising prices and historically high interest rates have made homeownership out of.