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by Kevin Morris Integration is the fundamental fuel that drives technical innovation. Each new node of Moore’s Law has allowed us to “Cram More Components” onto our integrated circuits, facilitating greater and greater levels of integration on chunks of silicon. But even in today’s “System on Chip” era, we do not truly have “systems” on a chip. Sure, we can pack processors, a lot of close peripherals, and some memory onto a single chip, but even our most integrated ICs pose challenges for bringing them into modern systems. The latest memory and data interfaces place heavy demands on board and module design for signal integrity and thermal performance, and the challenges of integrating the most sophisticated silicon devices we have today can be daunting.

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