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Korean chipmaker SK hynix joins hands with TSMC in strengthening HBM capabilities

Korean chipmaker SK hynix said Friday it has set up a strategic partnership with Taiwan Semiconductor Manufacturing Company (TSMC) aimed at bolstering its capabilities in producing premium high bandwidth memory (HBM) chips and advanced packaging technologies.

South koreaT ai peiJustin kimTaiwan semiconductor manufacturing company

SK Hynix Partners With TSMC On HBM4 Memory & Next-Gen Packaging Technology Development, Eyes 2026 Release

SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2.

Kevin zhangJustin kimOperations officeBusiness developmentDeputy coEnters thePartners withNext gen memorySenior vice presidentOverseas operations officeDeputy co chief operating

SK Hynix and TSMC Collaborate to Advance HBM4 Memory Technology

SK Hynix has entered into an agreement with TSMC to jointly develop next-generation High Bandwidth Memory (HBM) solutions

Justin kimKevin zhangTaiwan semiconductor manufacturing companyOperations officeDeputy coBusiness developmentHigh bandwidth memorySenior vice presidentOverseas operations officeDeputy co chief operating officer

SK hynix Partners with TSMC on HBM - High-Performance Computing News Analysis

SK hynix Partners with TSMC on HBM - High-Performance Computing News Analysis
insidehpc.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from insidehpc.com Daily Mail and Mail on Sunday newspapers.

Soult ukpyolsiSouth koreaKevin zhangJustin kimOperations officeDeputy coBusiness developmentSenior vice presidentOverseas operations officeDeputy co chief operating

TSMC and SK Hynix team up to defeat Samsung in next-gen memory chips

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