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Samsung to use chip making tech favoured by SK Hynix as AI chip race heats up, ET Telecom

One of the reasons Samsung has fallen behind is its decision to stick with chip making technology called non-conductive film (NCF) that causes some production issues, while Hynix switched to the mass reflow molded underfill (MR-MUF) method to address NCF s weakness, according to analysts and industry watchers.

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Exclusive-Samsung to use tech favoured by SK Hynix as AI chip making race heats up, sources say

SEOUL :Samsung Electronics plans to use a chip making technology championed by rival SK Hynix, five people said, as the world's top memory chipmaker seeks to catch up in the race to produce high-end chips used to power artificial intelligence.The demand for high bandwidth memory (HBM) chips has boomed with th

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Tech Talk: Samsung to use chip making tech favoured by SK Hynix as AI chip race heats up

Tech Talk: Samsung to use chip making tech favoured by SK Hynix as AI chip race heats up
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Exclusive-Samsung to use chip making tech favoured by SK Hynix as AI chip race heats up, sources say

Exclusive-Samsung to use chip making tech favoured by SK Hynix as AI chip race heats up, sources say
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Samsung to use chipmaking tech favoured by SK Hynix as AI chip race heats up: sources

Samsung to use chipmaking tech favoured by SK Hynix as AI chip race heats up: sources
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