Bill Hugle and Frances Sarnat married in 1947 after each had earned an undergraduate degree in chemistry at the University of Chicago. The two started a business making artificial gemstones in 1948, but the venture went bust by 1951 because of a patent infringement lawsuit brought against Bill Hugle by Linde Air Products, which had…
MILPITAS, Calif. – Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach USD 29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the USD 26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International reports.
SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report MILPITAS, Calif., May 23, 2023 /PRNewswire/ Powered by strong demand for new electronics innovations
The report provides an analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.