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Apple UltraFusion relies on TSMC 3DFabric packaging technology

Apple s innovative UltraFusion packaging architecture relies on TSMC s 3DFabric packaging platform, according to industry sources.

Global 1Q23 enterprise SSD revenue falls by nearly half

Due to a slump in both volume and prices, revenue in the enterprise SSD market fell 47.3% sequentially to nearly US$2 billion in the first quarter of 2023, according to TrendForce.

AI may not stimulate consumer electronics replacement demand until 2024

Artificial intelligence (AI) may not trigger replacement demand for consumer electronics until at least 2024, according to sources at IC design houses.

Innodisk expects more revenue generated from edge AI solutions

Innodisk expects more revenue generated from edge AI solutions
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FHD to become mainstream for computing products, says OmniVision

Full HD (FHD), or 1080p, will overtake 720p as the standard for computing products, according to CMOS image sensor (CIS) supplier OmniVision Technologies.

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