Fibocom Launches 5G Module Series FG130 and FM130 Powered by Qualcomm® 315 5G IoT Modem-RF System to Advance 5G Deployment in IoT
eejournal.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from eejournal.com Daily Mail and Mail on Sunday newspapers.
Fibocom Launches 5G Module Series FG130 and FM130 Powered by Qualcomm® 315 5G IoT Modem-RF System to Advance 5G Deployment in IoT
mobilitytechzone.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from mobilitytechzone.com Daily Mail and Mail on Sunday newspapers.
If there is one prominent theme in today’s chip design, it is that of tightly integrated frontend-to-backend systems. A recent 5G announcement highlights this trend in the expanding wireless IoT space.
The drive toward the integration of functions, components, and features is also supported by Makimoto’s wave. Since approximately 2017, the chip design and EDA tools market has been in the customization portion of the Makimoto Wave pendulum, where highly customized electronic content is dominant.
The latest manifestation of packing more components into one chip package comes with the announcement of Qualcomm’s new 315 5G IoT Modem, for example, designed for Industrial IoT applications such as energy, manufacturing, construction, mining, and precision agriculture.