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UP Xtreme x11 SBC with Tiger Lake Opens at $299
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Compact Tiger Lake Module Features Soldered RAM
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congatec launches 20 Computer-on-Modules with 11th Gen Intel Core processors
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First COM Express Module to feature Intel Core, Xeon and Celeron 6000 processors
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February 18, 2021
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congatec – a leading vendor of embedded and edge computing technology – focuses on customers’ ruggedization challenges at virtual embedded world 2021, presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules.
The solution portfolio for COM-HPC server modules is particularly impressive, tackling the fact that a significantly higher TDP must be mastered for these edge computing platforms, which represents a challenging task especially in the extended temperature range.
The driving force behind this focus is the increasing demand for rugged edge and real-time fog computing technologies to facilitate digitization projects in often extremely harsh and challenging environments. Typical use cases for these ultra-durable platforms can be found in critical railway, road traffic and smart city infrastructures, offshore rigs and wind parks, electricity distribution networks, piping syst