Unmanned aerial vehicles (UAVs) are rapidly swarming modern battlespaces, growing in number as they shrink in size. They are meeting strict guidelines for reduced size, weight, and power (SWaP) even as their capabilities increase, packing payloads that include offensive ordnance, transmitters, receivers, cameras, and sensors. Miniaturization contributes not only to added functionality but to longer flight times and ranges on a battery. Advancing UAV technology for the battlefield presents the ongoing challenge of developing electronic payloads that are smaller and with wider bandwidths to support multiple sensors without delays. What once was a complete electronic warfare (EW) system carried by a large ground vehicle must now fit within a flight-ready vehicle that, in some cases, can be launched by hand. Fortunately, by fitting multifunction circuitry within a single multipin package, in the form of system-on-chip (SoC) or system-in-package (SiP) devices, versatile payloads ca
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Led by Bosch, the University of Stuttgart, and the Karlsruhe Institute of Technology (KIT), a total of thirty companies will define the foundations for software-defined manufacturing (SDM) over the next three years in the SDM4FZI research project (Software-Defined Manufacturing for the Vehicle and Supplier Industry). The goal is to design.