TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
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TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
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Synopsys Receives Customers Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum
MOUNTAIN VIEW, Calif., Feb. 9, 2021 /PRNewswire/  Synopsys, Inc. (Nasdaq: SNPS) today announced it received the Customers Choice Award for a technical paper presented at the TSMC 2020 North America Open Innovation Platform
® (OIP) Ecosystem Forum. The paper, titled 5nm Node Enablement and Maximizing QoR Using Fusion Compiler
â¢, was developed and presented by Henry Sheng, group director of Engineering at Synopsys. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.  Our customers appreciate Synopsys sharing their technical knowledge and expertise in enabling the next-generation designs in fast-growing mrkets such as 5G, mobile and automotive, said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. I m pleased to congratulate Synopsys as the winner of th
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New York, Dec. 29, 2020 (GLOBE NEWSWIRE) Reportlinker.com announces the release of the report Embedded Die Packaging Market - Growth, Trends, Forecasts (2020 - 2025) - https://www.reportlinker.com/p06000980/?utm source=GNW Micromachining and nanotechnology play an increasingly important role in the miniaturization of components ranging from biomedical applications to chemical microreactors and sensors. For instance, Bluetooth wifi modules requires minimal circuit board area on today s high-density mobile devices.
- Improved electrical & thermal performance is driving the market. For power management and mobile-wireless application the embedded technology has been evaluated to replace assembles fabrication by not only thinner thickness but due to superior thermal performance. The thermal performance of embedded die is better than PQFN with copper clip about 17%. Also a new and expandable advanced package for power devices is developed using embedded dies and redistrib