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Winbond introduces CUBE architecture for powerful Edge AI devices – CIE

Winbond introduces CUBE architecture for powerful Edge AI devices – CIE
cieonline.co.uk - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from cieonline.co.uk Daily Mail and Mail on Sunday newspapers.

Winbond electronics corporationEffective solutionHigh bandwidthSoc die sizeImproved cost efficiency

New Electronics - Winbond introduces CUBE architecture for Edge AI devices

Winbond Electronics has unveiled a powerful enabling technology that enables more affordable Edge AI computing in mainstream use cases.

Effective solutionHigh bandwidthSoc die sizeImproved cost efficiency

Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company's new customized ultra-bandwidth elements.

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