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Nanotechnology Now - Press Release: A silver lining for extreme electronics

Nanotechnology Now Home > Press > A silver lining for extreme electronics MSU researchers developed a process to create more resilient circuitry, which they demonstrated by creating a silver Spartan helmet. The circuit was designed by Jane Manfredi, an assistant professor in the College of Veterinary Medicine. Credit: Acta Materialia Inc./Elsevier Abstract: Tomorrow s cutting-edge technology will need electronics that can tolerate extreme conditions. That s why a group of researchers led by Michigan State University s Jason Nicholas is building stronger circuits today. A silver lining for extreme electronics East Lansing, MI | Posted on April 30th, 2021 Nicholas and his team have developed more heat resilient silver circuitry with an assist from nickel. The team described the work, which was funded by the U.S. Department of Energy Solid Oxide Fuel Cell Program, on April 15 in the journal Scripta Materialia.

Nanotechnology Now - Press Release: Expanding the freedom of design: powder coating on FRP thanks to conductive gelcoats with graphene nanotubes

Nanotechnology Now Our NanoNews Digest Sponsors Home > Press > Expanding the freedom of design: powder coating on FRP thanks to conductive gelcoats with graphene nanotubes Abstract: New conductive gelcoats with graphene nanotubes as a protecting layer on top of fiber-reinforced plastics (FRPs) grant engineers and designers the ability to produce special surfaces and uniformly coat all final parts regardless of their conductive and non-conductive nature. Ease of processing, flexibility in color effects, chemical resistance and zero emissions – powder coating on gelcoats offers a viable alternative to liquid painting of FRP parts in automotive, marine, aerospace, and even sanitary applications. Expanding the freedom of design: powder coating on FRP thanks to conductive gelcoats with graphene nanotubes

Nanotechnology Now - Press Release: Islands without structure inside metal alloys could lead to tougher materials: These high-entropy alloys could lead to better technologies in transportation, energy and denfense

Our NanoNews Digest Sponsors Home > Press > Islands without structure inside metal alloys could lead to tougher materials: These high-entropy alloys could lead to better technologies in transportation, energy and denfense Proposed hierarchical deformation mechanism paradigm for the equi- atomic CrCoNi-based HEAs subjected to increasing degrees of deformation. Elastic deformation, dislocation-mediated plasticity, twinning-induced plasticity, TRIP, and finally solid-state amorphization. Triggering the next mechanism re- quires the generation of additional defects, i.e., dislocations and/or point defects (vacancies). These multiple mechanisms can interact, leading to a synergy of strengthening processes and a resulting highly complex microstructure. CREDIT University of California San Diego

Nanotechnology Now - Press Release: Nanomaterials researchers in Finland, the United States and China have created a color atlas for 466 unique varieties of single-walled carbon nanotubes

Our NanoNews Digest Sponsors Home > Press > Nanomaterials researchers in Finland, the United States and China have created a color atlas for 466 unique varieties of single-walled carbon nanotubes. A color map illustrates the inherent colors of 466 types of carbon nanotubes with unique (n,m) designations based on their chiral angle and diameter. (Image courtesy of Kauppinen Group/Aalto University) Abstract: Nanomaterials researchers in Finland, the United States and China have created a color atlas for 466 unique varieties of single-walled carbon nanotubes. Nanomaterials researchers in Finland, the United States and China have created a color atlas for 466 unique varieties of single-walled carbon nanotubes.

Nanotechnology Now - Press Release: An LED that can be integrated directly into computer chips: The advance could cut production costs and reduce the size of microelectronics for sensing and communication

Nanotechnology Now Our NanoNews Digest Sponsors Home > Press > An LED that can be integrated directly into computer chips: The advance could cut production costs and reduce the size of microelectronics for sensing and communication MIT researchers have developed a bright, efficient silicon LED, pictured, that can be integrated directly onto computer chips. The advance could reduce cost and improve performance of microelectronics that use LEDs for sensing or communication. Credits:Courtesy of the researchers Abstract: Light-emitting diodes — LEDs — can do way more than illuminate your living room. These light sources are useful microelectronics too. An LED that can be integrated directly into computer chips: The advance could cut production costs and reduce the size of microelectronics for sensing and communication

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