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J2 and HKSTP to establish first silicon carbide fab in Hong Kong

Center in Science Park to conduct R&D and production of SiC chips

Yuen longHong kong generalHong kongAlbert wongRobert tsuSun dongLillian cheongPhilip yungMicroelectronics researchRd centreHeterogenous integration lab hiSemiconductor rd centreTechnology parks corporationMicroelectronics centre in yuen long innovation parkDevelopment instituteHardware lab

IT News Online - HKSTP and J2 Semiconductor Sign MoU to Promote the Development of Microelectronics Industry in Hong Kong J2 Semiconductor Plans to Establish R&D Center and First SiC Wafer Fab in Hong Kong

HKSTP and J2 Semiconductor Sign MoU to Promote the Development of Microelectronics Industry in Hong Kong J2 Semiconductor Plans to Establish R&D Center and First SiC Wafer Fab in Hong Kong

Hong kongYuen longHong kong generalRobert tsuPhilip yungSun dongLillian cheongTseung kwanAlbert wongHardware labOffice for attracting strategic enterprisesSemiconductor shanghai co ltdSemiconductor shanghai coIndustry bureauMicroelectronics centre in yuen long innovation parkRd centre

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