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Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox Standard

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox Standard
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Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard – Consumer Electronics Net

Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard – Consumer Electronics Net
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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023 United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…

United statesSouth koreaOsbert chengDon chanExchange commissionDigital signoff group at cadenceUnited microelectronics corporationCadence design systems incCadence design systemsSignoff groupImplementation systemExtraction solutionTiming signoff solutionVerification systemIntegrity solutionThermal solver

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow – Consumer Electronics Net

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow – Consumer Electronics Net
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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the. | February 1, 2023

United statesSouth koreaOsbert chengDon chanExchange commissionDigital signoff group at cadenceUnited microelectronics corporationCadence design systems incCompanies to workCadence design systemsSignoff groupImplementation systemExtraction solutionTiming signoff solutionVerification systemIntegrity solution