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Mini-Consortia Forming Around Chiplets

Mini-Consortia Forming Around Chiplets
semiengineering.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from semiengineering.com Daily Mail and Mail on Sunday newspapers.

United statesAndy heinigJawad nasrullaBill chenKevin yeePatrick soheiliMichael posnerDan kochpatcharinUcie chipletNathan whitchurchSemiconductor engineering chiplet summitSamsung electronicsAmkor technologyAnemoi softwareIntel foundry servicesEngineering of adaptive systems division

True 3D Is Much Tougher Than 2 5D

True 3D Is Much Tougher Than 2 5D
semiengineering.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from semiengineering.com Daily Mail and Mail on Sunday newspapers.

Siemen mastroianniRob aitkenTony mastroianniVinay patwardhanMaurice steinmanMarc swinnenThomas uhrmannSynopsy aitkenJohn parkAndy heinigGroup at cadenceEngineering of adaptive systems divisionEv group uhrmannDigital signoff group at cadenceEv groupAdaptive systems

Chip Design Shifts As Fundamental Laws Run Out Of Steam

Chip Design Shifts As Fundamental Laws Run Out Of Steam
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Saugat senChris muethSimon davidmannRoddy urquhartRoland janckeMovellu karvatStuart clubbChristian jacobiVik karvatRobert dennardKeysight muethEngineering of adaptive systems divisionImperas softwareAdaptive systemsSapphire rapidsFalcon shore

Can Analog Make A Comeback?

Can Analog Make A Comeback?
semiengineering.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from semiengineering.com Daily Mail and Mail on Sunday newspapers.

New yorkUnited statesWikimedia commonsBenjamin prautschMarc swinnenTim vangSiemen vishwakarmaMo faisalLos angelesTim vehlingFraunhofer prautschScott hansonSumit vishwakarmaEngineering of adaptive systems divisionSemtech signal integrity solutions groupAdaptive systems

Keeping IC Packages Cool

Keeping IC Packages Cool
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Eric ouyangRandy whiteJohn parryAndy heinigTed sperlingYoungdo kweonSiemen parryMike mcintyreEngineering of adaptive systems divisionSiemens digital industries softwareSiemens digital industriesSteven wooAdaptive systemsUsing package thermal informationChiplet moduleMonolithic die