TOKYO, Japan, June 21, 2022 ―Renesas Electronics Corporation (TSE: 6723) today announced the SmartBond™ DA1470x Family of Bluetooth® low energy (LE) solutions―the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a…
Advanced development teams can distribute functions across different layers, using Telit App Zone SDK to develop BSP functions and drivers in C/C++, while using MicroEJ layer to develop the application Telit+MicroEJ enables complex application development, with support for Java, Kotlin and JavaScript programming languages on embedded platforms Irvine, Calif., June 20, 2022 – Telit, a global…