HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023 United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…
UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow – Consumer Electronics Net consumerelectronicsnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from consumerelectronicsnet.com Daily Mail and Mail on Sunday newspapers.
United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the. | February 1, 2023
UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow hpcwire.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from hpcwire.com Daily Mail and Mail on Sunday newspapers.
Cadence Recognized with TSMC OIP Ecosystem Forum Customers Choice Award for 3D-IC Design iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.