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On the launch of MediaTek’s new Dimensity 1200 flagship 5G smartphone chip, Realme has today announced that it will be one of the first brands to introduce a smartphone with Dimensity 1200, to build dual flagships portfolio in 2021. Relying on the comprehensive improvement of Dimensity 1200 in 5G, AI, photography, video, and games, the Realme flagship smartphone will provide users with a superior 5G all-around experience.
As per a report of GSMArena, the Realme X9 Pro will be one of the first Dimensity 1200-powered phones. The phone is expected to be the successor of the Realme X7 series.
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This time, MediaTek launched the Dimensity 1200 flagship 5G smartphone chip with a 6nm advanced production process, which brings powerful performance and lowers power consumption. With this, the Dimensity 1200 creates a seamless 5G experience in all scenarios at all times, maintaining its 5G leadership in the process. At the same time, Dimensity 1200 achieve
MediaTek has introduced a couple of new high-end chipsets, the Dimensity 1200 and 1100. The former is the most high-end of the two, with a flagship 3GHz core and support for 200MP cameras.
The MediaTek Dimensity 1200 is coming and it will offer flagship performance for cheap
MediaTek s Dimensity series has proven to be a solid lineup. (Source: MediaTek)
MediaTek s Dimensity lineup has turned out to offer some of the most impressive chipsets on the market, and the Taiwanese company is set to release the line-leading offering on January 20. The MediaTek Dimensity 1200 is coming, and it will offer flagship performance at an affordable price point.
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MediaTek s comeback has been rather impressive. Starting with the Helio G90T that debuted on the Redmi Note 8 Pro and on to the class-leading Dimensity series, MediaTek has fought back from oblivion to become solid contenders in a market traditionally dominated by Qualcomm. The Taiwanese company is looking to continue on that path, too.