HOUSTON, Texas. Octavo Systems, company specializing in mass market system-in-package (SiP) solutions, announced a new family of SiP devices based on the AMD Xilinx Zynq UltraScale+ MPSoC Architecture.
Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in- Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in- Package while delivering the performance and flexibility expected from the Zynq UltraScale+…