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MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Expo
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MacDermid Alpha to Promote Latest Technology Offerings at International Electronics Circuit Exhibition
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s almost summer, and I’m glad the cold weather is gone. It’s time for the middle-aged men of the world to don their Hawaiian shirts once again!
But it doesn’t look like there’s much of a summer vacation afoot for this industry. In the past week, we saw lots of traction with our coverage of everything from M&A activity and the supply chain shortage to challenges facing PCB designers, Spanish language training courses, and designing for semi-additive processes.
We’re getting somewhat back to normal, with managers of DesignCon and SMTA International promising that these will be live, in-person events this year. Let’s hold a good thought. I’m ready to travel again. I’ll never complain about back-to-back trade shows again!
I-Connect007 Editor s Choice: Five Must-Reads for the Week
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.
MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.
ALPHA OM-372 is designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004). A combination of these best-in-class features as well as excellent HIP and NWO performance makes it ideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor components.