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Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging | European American Chamber of Commerce New York [EACCNY]

Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging | European American Chamber of Commerce New York [EACCNY]
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United statesSouth koreaGeorgia institute of technologyState of georgiaLaurie locascioHeather bousheyGina raimondoBiden harris administrationDevelopment officeGeorgia piedmont technical collegeDepartment of defense heterogeneous integrated packagingProgram officeNational institute of standardsGeorgia institute of technology techUs department of commerceDepartment of commerce

GovCon Expert Cameron Chehreh: How Agencies Should Prepare for the Next Wave of Pervasive Connectivity

Looking for the latest GovCon News? Check out our story: GovCon Expert Cameron Chehreh: How Agencies Should Prepare for the Next Wave. Click to read more!

United statesCameron chehrehDepartment of defense heterogeneous integrated packagingUs department of agricultureEmergency management agencyVice presidentGeneral managerPublic sectorFederal emergency management agencyGovcon wireDaily updatesNews briefings

BAE Receives Multichip Prototypes From Intel, Qorvo Under Pentagon s SHIP Program; Heidi Shyu Quoted

Looking for the latest GovCon News? Check out our story: BAE Receives Multichip Prototypes From Intel, Qorvo Under DOD's SHIP Program. Click to read more!

United statesFalls churchHeidi shyuDepartment of defense heterogeneous integrated packagingBae systemsGovcon wireDaily updatesNews briefings

CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets

• Fortrix™ SecureD2D IP enables secure authentication and firmware boot/code load between chiplets in a heterogeneous system-on-chip (HSoC) • IP adopted by leading system companies as part of Department of Defense State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program ROCKVILLE, MD, January 26, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing…

Mark bealDepartment of defenseGartner researchCeva incDepartment of defense heterogeneous integrated packagingLockheed martinHeterogenous systemFortrix securedIntrinsix business unitDigital signal processorsHillcrest labs

Security IP for Die-to-Die communication between chiplets

CEVA has expanded its IP reach by introducing the Fortrix SecureD2D IP solution, enabling secure data exchange between different chiplets within a Heterogenous System on Chip (HSoC).

Mark bealDepartment of defenseGartner researchDepartment of defense heterogeneous integrated packagingLockheed martinFortrix securedHeterogenous systemIntrinsix business unit