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New QNX 7 BSP for Boundary Devices Nitrogen 8M SSBC from Direct Insight speeds development time – EEJournal

Oxfordshire, UK December 2021: Direct Insight, the UK-based, technical systems integrator and reseller of system-on-module (SoM) and other embedded systems, has developed a Board Support Package (BSP) which enables the use of QNX 7 with the Boundary Devices' Nitrogen 8M board, an ARM-based single board computer (SBC) designed to leverage the full capabilities of NXP’s i.MX8M Mini Quad…

David pashleyUnited kingdom decemberDirect insightUnited kingdom basedBoard support packageBoundary device nitrogenMini quad

Power-efficient SoC modules suit medical and industrial applications

Power-efficient SoC modules suit medical and industrial applications
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Daniel langToradex colibriDavid pashleyDirect insightSupport packageBoard support packageடேனியல் லாங்நேரடி நுண்ணறிவுஆதரவு ப்யாகேஜ்பலகை ஆதரவு ப்யாகேஜ்

QNX 7 board support package for Toradex Colibri iMX8X

QNX 7 board support package for Toradex Colibri iMX8X
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United kingdomDavid pashleyDirect insightஒன்றுபட்டது கிஂக்டம்நேரடி நுண்ணறிவு

Evertiq - Low power, multi-featured module enables PCIe access

New i.MX8M Mini solder-down SoM from Direct Insight combines high performance, miniaturization and low cost.

David pashleyKa ro electronicsDirect insightUnited kingdom basedAachen based ka ro electronicsComments david pashleyகா றோ மின்னணுவியல்நேரடி நுண்ணறிவுஒன்றுபட்டது கிஂக்டம் அடிப்படையிலானதுஆச்சென் அடிப்படையிலானது கா றோ மின்னணுவியல்

New i MX8M Mini solder-down SoM from Direct Insight combines high performance, miniaturization and low cost

Low power, multi-featured module enables PCIe access Oxfordshire, UK May 2021: Direct Insight, the UK-based, technical systems integrator and reseller of system-on-module (SoM) and other embedded systems, has announced the new QSXM solder-down module, manufactured by the company’s long-standing partner, Aachen-based Ka-Ro Electronics, which features NXP’s latest dual and quad-core i.MX8M Mini ARM Cortex-A53 64-bit processors, plus 2GB of 32-bit LPDDR4 RAM, 4GB eMMC Flash memory and power management. The new QSXM solder-down module measures just 29mm square, with a height of 2.6mm, providing unparalleled miniaturisation, thermal efficiency and EMI performance, with the base functioning as both a ground pad and a thermal conductor. Rugged and connector-free, solder-down SoM technology offers a range of benefits, especially for higher-volume requirements, including availability in tape-and-reel packaging.

United kingdomDavid pashleyKa ro electronicsUnited kingdom mayDirect insightUnited kingdom basedAachen based ka ro electronicsஒன்றுபட்டது கிஂக்டம்கா றோ மின்னணுவியல்ஒன்றுபட்டது கிஂக்டம் இருக்கலாம்நேரடி நுண்ணறிவுஒன்றுபட்டது கிஂக்டம் அடிப்படையிலானதுஆச்சென் அடிப்படையிலானது கா றோ மின்னணுவியல்