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SK Hynix Introduces 176-Layer 3D NAND Flash Chips Dec 14, 2020 13:26 EST
SK Hynix has announced its 176-layer NAND flash chips, and these NAND chips are different as they use Peripheral under Cell design instead of the conventional design. This design maximizes production efficiency while reducing the NAND die size. SK Hynix has provided samples to controller companies in November to have solution products created.
SK Hynix s 176-layer NAND flash chip is the newest generation of its 4D NAND flash chips series
SK Hynix has been promoting and developing its 4D technology, starting at its 96-layer NAND flash products, and continuing its current iteration, its 176-layer NAND flash chips. The 176-layer NAND chips are the third generation of SK Hynix s 4D technology, ensuring that these NAND chips have the industry s best number of chips per wafer.