San Diego, CA, 13. December 2022 congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini. The new COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first…
congatec has announced that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini.
WAKEFIELD, MA., USA, December 8, 2022. PICMG, a leading consortium for the development of open embedded computing specifications, announces that the COM-HPC committee has finalized the pinout and dimension definitions for the COM-HPC Mini form factor in record time. This means that the vast majority of the details of the COM-HPC Mini standard have been…
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