Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity of Chip on Wafer on Substrate (CoWoS) packaging at TSMC.
Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on Substrate (CoWoS) packaging at Taiwan Semiconductor Manufacturing Co (NYSE:TSM). Industry insiders see FOPLP as a viable alternative to CoWoS due to TSMC’s limited CoWoS capacity and the rising demand for AI chips driven by generative AI applications. A senior executive from China Wafer Level CSP sta
KUALA LUMPUR, April 28 DAP chairman Lim Guan Eng said today he will be meeting Penang Chief Minister Chow Kon Yeow to seek clarification as to the state’s necessity for an.
GEORGE TOWN: The Penang State Government is working with the Federal Government to continue efforts in attracting investment in the semiconductor sect.