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Semiconductor and IC Packaging Materials Global Report 2023
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Global Semiconductor and IC Packaging Materials Strategic Business Report 2023 - IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging Technologies & Materials
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Global Bonding Wire Packaging Material Industry (2020 to 2027) - Market Trajectory & Analytics - ResearchAndMarkets.com
February 8, 2021 GMT
DUBLIN (BUSINESS WIRE) Feb 8, 2021
The publisher brings years of research experience to the 9th edition of this report. The 188-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
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Global Bonding Wire Packaging Material Market to Reach $3.1 Billion by 2027
Amid the COVID-19 crisis, the global market for Bonding Wire Packaging Material estimated at US$2.8 Billion in the year 2020, is projected to reach a revised size of US$3.1 Billion by 2027, growing at a CAGR of 1.3% over the analysis period 2020-2027.