/Electronics Bonding Wire Market Report By Top Vendors, Growth, Major Drivers, Demand, Mega Trends, Regions And Forecast Till 2027
Electronics Bonding Wire Market Report By Top Vendors, Growth, Major Drivers, Demand, Mega Trends, Regions And Forecast Till 2027
Electronics Bonding Wire Market to 2027 - COVID-19 Impact and Global Analysis
tipMay 12, 2021 7
Wire bonding is the method of using fine wires made of materials like gold and aluminium to create electrical interconnections between semiconductors (or other integrated circuits) and silicon chips. Gold ball bonding and aluminium wedge bonding are the two most common methods. Wire bonding is a method of connecting an integrated circuit (IC) to other electronics or from one printed circuit board (PCB) to another. Wire bonding is the most cost-effective and versatile interconnect process, and it’s how the vast majority of semiconductor packages are put together.