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Who will foot the chip bill for extra tax? Taiwan-US signs first trade pact without resolving tax issues

After months of negotiations, Taiwan and the U.S. signed the first agreement under the U.S.-Taiwan Initiative on 21st-Century Trade on June 1 in Washington D.C. It outlines practices and procedures aimed at streamlining and strengthening trade relations. Both sides of negotiators deserve a round of accolades, but the fact that it does not cover tariff reductions or exemptions still puts many stakeholders down.

Fujifilm set to expand production of advanced semiconductor materials in Taiwan

Japan s Fujifilm Holdings has disclosed plans to invest NT$3.38 billion (US$110 million) to bolster production of chemical mechanical planarization (CMP) slurry and lithography-related materials in Taiwan to better serve its semiconductor customers.

Techwinsemi to expand outsourcing in Taiwan

Chinese memory module company Techwinsemi Technology plans to enhance its outsourcing business in Taiwan, looking to expand its supplier list to include flash controller vendors and backend service houses.

Keysight joins TSMC OIP 3D Fabric Alliance

Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric Alliance formed to accelerate 3D IC ecosystem innovation and readiness. The membership will allow the US vendor to utilize the TSMC 3Dblox standard to develop electronic design automation (EDA) software and testing solutions.

Nvidia contracts TSMC to manufacture next-gen AI chip, says Huang

Nvidia s next-generation AI chip will continue to be manufactured by TSMC, said company CEO Jensen Huang in response to market concerns regarding the processor vendor s partnership with the pure-play foundry.

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