Purdue engineers are taking building possibilities to new heights with the university’s role in the research and development of an innovative high-rise construction process.
Leaders from industry, government and academia convened at a summit Tuesday (April 18) in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
From creating microchip ‘clocks’ to authoring a book series on semiconductors, Purdue continues to forge the future of microelectronics in 2023. Purdue University’s persistent pursuit of microchip advancement through the innovation, partnerships and programs highlighted in this roundup continues to move the field forward. If you have any questions or would like to speak to a Purdue expert, contact Brian Huchel, bhuchel@purdue.edu.
Purdue University engineers and entomologists are making some sweet discoveries about how honeybees build and structure their honeycombs, which could lead to new fabrication techniques taken from the buzzing builders.