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Resonac : Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%— Aiming to cope with medium- to long-term increase in demand —

April 04, 2023 Resonac Corporation Resonac Corporation will increase its capacity to produce "Dicing Die Bonding Film," which is a two-in-one adhesive film. | April 4, 2023

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The Worldwide Bonding Sheet Industry is Expected to Reach

Dublin, July 13, 2022 (GLOBE NEWSWIRE) The "Bonding Sheet Market by Adhesive Material (Polyesters, Polyimides, Acrylics, Modified Epoxies),.

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Die Bonding Film Market share forecast to witness considerable growth from 2020 to 2026 | By Top Leading Vendors – Furukawa, Henkel Adhesives, LG, AI Technology, etc – KSU

Die Bonding Film Market share forecast to witness considerable growth from 2020 to 2026 | By Top Leading Vendors – Furukawa, Henkel Adhesives, LG, AI Technology, etc – KSU
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Republic ofAi technologyCompany profilesDie bonding film market insightsDie bonding film marketKey playersLeading regionsDie bonding filmHenkel adhesivesHitachi chemicaland moreBonding filmProduct type segmentationNon conductive typeConductive typeIndustry segmentationRegions covered