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Infineon AIROC™ CYW20829 Bluetooth LE SoC ready with latest Bluetooth 5 4 specification

Munich, Germany – 23 March, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its AIROC™ CYW20829 Bluetooth® LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of…

New Bluetooth LE SoC for IoT smart home and industrial applications

Nodle Grants Berty Foundation $1 Million in Nodle Cash to Advance Its Privacy Communication Protocol

Nodle Grants Berty Foundation $1 Million in Nodle Cash to Advance Its Privacy Communication Protocol
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Nodle Announces Partnership with ESTV – Consumer Electronics Net

Nodle Announces Partnership with ESTV – Consumer Electronics Net
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