(Bloomberg) Intel Corp. is spending $7 billion to build a new chip packaging facility in Malaysia, a major Asian investment intended to address endemic global semiconductor shortages at a time Washington is advocating domestic production.
The U.S.
(Bloomberg) Intel Corp. Chief Executive Officer Pat Gelsinger will visit Taiwan and Malaysia next week for talks that show how manufacturing in Asia is crucial to his efforts to turn around the fortunes of the world’s largest chipmaker by revenue.
(Bloomberg) Intel Corp., the world’s largest chipmaker, gave a lackluster forecast for the current period, fueling concerns that the cost of Chief Executive Officer Pat Gelsinger’s turnaround will weigh on the company’s profits. Shares fell about 6% in extended trading.
(Bloomberg) Intel Corp. supplier Austria Technologie & Systemtechnik AG is plotting to become a top provider of a specialty material essential to the high-performance computing chips used in PCs and data centers to fuel growth.