GRENOBLE, France – April 13, 2023 – CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla. The institute is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch)…
Doha: The Qatar University Young Scientists Centre (QU YSC), in partnership with the Office of the Vice President for Research and Graduate Studies (V.
/PRNewswire/ AMCP Foundation and CVS Health announced the recipients of AMCP Foundation s Best Poster Awards at AMCP 2023. This semiannual competition.
/PRNewswire/ The Society of Toxicology (SOT) Medical Device and Combination Product Specialty Section has given a Best Poster Award in the Medical Device.