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NexWafe GmbH Lands €10 Million Funding Round, Aims to Cut Solar Production Costs by 30%, Reduce CO2 Emissions by 70%

Press release content from Business Wire. The AP news staff was not involved in its creation. NexWafe GmbH Lands €10 Million Funding Round, Aims to Cut Solar Production Costs by 30%, Reduce CO2 Emissions by 70% February 4, 2021 GMT FREIBURG, Germany (BUSINESS WIRE) Feb 4, 2021 NexWafe GmbH, today announced completion of a €10 million capital raise with participation from both existing and new shareholders. Pioneers of in-line epitaxy for production of high-efficiency monocrystalline silicon wafers, NexWafe’s EpiWafers provide solar panel manufacturers with dramatically higher efficiency and uncompromised yield at 70 percent of the cost of traditional monocrystalline Cz-Si, all without having to retool their production lines. NexWafe’s technology also allows for production of ultra-thin wafers, already demonstrated in the company’s pilot line in Freiburg, providing a roadmap to next-generation ultra-thin and tandem architectures.

NexWafe GmbH Lands 10 Million Funding Round, Aims to Cut Solar Production Costs by 30%, Reduce CO2 Emissions by 70%

NexWafe GmbH Lands 10 Million Funding Round, Aims to Cut Solar Production Costs by 30%, Reduce CO2 Emissions by 70%
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NexWafe GmbH Lands €10 Million Funding Round, Aims to Cut Solar Production Costs by 30%, Reduce CO2 Emissions by 70%

(1) High-efficiency monocrystalline silicon wafer manufacturer gears up for commercialization of its wafer technology, adds veteran VC to corporate board NexWafe GmbH, today announced completion of a €10 million capital raise with participation from both existing and new shareholders. Pioneers of in-line epitaxy for production of high-efficiency monocrystalline silicon wafers, NexWafe s EpiWafers provide solar panel manufacturers with dramatically higher efficiency and uncompromised yield at 70 percent of the cost of traditional monocrystalline Cz-Si, all without having to retool their production lines. NexWafe s technology also allows for production of ultra-thin wafers, already demonstrated in the company s pilot line in Freiburg, providing a roadmap to next-generation ultra-thin and tandem architectures.

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