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Electromigration Concerns Grow In Advanced Packages

Electromigration Concerns Grow In Advanced Packages
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Amkor zwengerMarc swinnenJihye kwonDermott lynchSynopsy lynchCurtis zwengerAnsy semiconductor divisionElectronics packaging technology conferenceSemiconductor engineeringAnsy semiconductorHye kwonPerformance of fine line cu redistribution layerElectromigration studyExtreme conditionsHigh power applications