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TSMC to build massive chips twice the size of today's largest — chips will use thousands of watts of power

TSMC preps 8x reticle size or larger interposers for gargantuan AI and HPC SiPs.

United-states
American
American-technology-symposium
Broadcom
North-american-technology

TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips

TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

TSMC's System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips
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United-states
American
Kevin-zhang
American-technology-symposium
Business-development
Integrated-chips
North-american-technology-symposium
Vice-president

TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect

TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect
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United-states
American
American-technology-symposium
Optical-engine
Universal-photonic-engine
Optical-engine-strategy

TSMC introduces cheaper 4nm chips, vows to bring 1.6nm chips in 2026

TSMC announced its 1.6nm chip fabrication process, and mass production of such chips will start in 2026. It also revealed cheaper 4nm chip process. - SamMobile

South-korea
United-states
Taiwan
South-korean
American
Taiwanese
Backside-power-delivery-network
Nvidia
Chip-fabrication-process-technology
Samsung
American-technology-symposium

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