IDEX Biometrics Further Strengthens its Supply Chain by Partnering with MFLEX
IDEX Biometrics ASA, a leading provider of advanced fingerprint identification and authentication solutions, has signed an agreement with Multi-Fineline Electronix, Inc. (MFLEX), a subsidiary of Suzhou Dongshan Precision Manufacturing Co., Ltd. (DSBJ), and a leading global provider of high-quality, technologically advanced flexible printed circuits and assemblies. The agreement forms a key part of IDEX’s mass production ready supply chain, essential to meet the growing demand for biometric payment cards.
Under the agreement, MFLEX will provide flexible printed circuit assemblies for IDEX’s biometric payment card reference design. This reference design is the only biometric smart card reference design that has been used in cards certified by China UnionPay. MFLEX has received an initial order from a Tier 1 card manufacturer.
DOD, Draper to Support of Computer Chips Advanced Packaging Solutions
The Department of Defense (DOD) entered into a $14 million agreement with Draper to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems.
Draper received a $10 million contract from the Defense Production Act (DPA) Title III office. The company also received a $4 million contract from the DOD Industrial Base Analysis and Sustainment (IBAS) office. Draper intends to expand existing domestic supplier production capabilities to produce three dimensional (3D), ultra-high-density microelectronics modules for use in mission critical applications. Draper’s integrated ultra-high-density technology is in high-volume production at i3 Microsystems’ fabrication facility in St. Petersburg, Fla.
03/26/2021 |
Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion! 03/18/2021 |
Nolan Johnson, PCB007
Nolan Johnson talks with Eduardo Benmayor, general manager at Aismalibar, about materials challenges facing the powertrain portion of the automotive EV industry. Eduardo also speaks about what he sees as the biggest challenge facing EVs infrastructure.
Printer Version Aismalibar, American Standard Circuits Confirm IST Thermal Testing of HTC 3.2w High Tg Multilayer Thermal Conductive Material
Aismalibar and American Standard Circuits confirm successful IST thermal testing of HTC 3.2w High Tg Multilayer Thermal Conductive Material.
In order to confirm that the Aismalibar High Tg (180 °C), thermal conductive (3.2 w/mc), multilayer material system would pass rigorous automotive thermal cycling testing, the proven IST thermal testing methodology was chosen. American Standard Circuits manufactured the thermal conductive multilayer test panels. PWB Interconnect Solutions Inc. performed the thermal cycling testing.
“We believe there is no better material on the market today than Aismalibar’s HTC 3.2w High Tg Multilayer Thermal conductive material. To demonstrate that, we passed it through very rigorous thermal cycling testing. The best part? Our trusted customer
American Standard Circuits Offers Resource Page
As part of a continuous effort to contribute to the PCB industry, American Standard Circuits is now offering a technical resource page on their corporate website.
The new educational and technical resource Page contains access to a wealth of informative content generated by the expert team at American Standard Circuits. These offerings include a vast webinars series, often featuring expert partner vendors like Ventec, Aismalibar and Insulectro, as well as all of their expert columns published by I-Connect007, their four downloadable micro eBooks, and other articles and resources developed top further increase the bond of knowledge between the PCB fabricator and their customers.