Organizations sign five-year extension to their R&D engagement, including an expansion of the Applied Materials–Institute of Microelectronics Center of Excellence in Advanced Packaging in Singapore New phase of research aims to accelerate breakthroughs in materials, equipment and process technologies for hybrid bonding and other emerging, 3D chip integration technologies Expansion provides semiconductor and systems companies…
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Applied Materials Introduces New Technologies and Capabilities for Accelerating the apnews.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from apnews.com Daily Mail and Mail on Sunday newspapers.